Nvidia recently publicly demonstrated a next-generation co-package optical (CPO) technology called Ooi (Optics ‑ on ‑ Interposer) at Semicon West 2026. Unlike the existing CPO scheme, Ooi chose to take down the organic packaging substrate, integrate the light engine directly onto the GPU-carrying silicon intermediate layer, move the photoelectric conversion link closer to the chip core, and provide a new interconnection idea for the next generation of hyperscale AI clusters. According to Nikola Nedovic, chief research scientist at NVIDIA Research Institute, the scheme replaces the current organic packaging substrate with a larger intermediate layer, and NVIDIA has already obtained a prototype. Ooi is still in the research phase and there is no timeline for commercialization. (Finance Association)
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