Sources say Samsung intends to build Taylor Plant 2 to produce HBM base die for AMD and Nvidia

It is reported that Samsung Electronics plans to officially start construction of the second wafer foundry (Taylor II Plant) in Taylor, Texas, United States in November 2026. The planned capacity of the plant has been fully booked by customers, most of which are orders from AMD, and Nvidia also has related capacity arrangements. Samsung officials said it could not confirm the specific details related to the customer. The Taylor II plant covers an area of about 250,000 square meters, which is about 1.5 times the size of the Taylor I plant, and will use a 2-nanometer process. According to the current plan, the production line is expected to start moving into equipment in February 2029 and formally mass-produce in 2030. Unlike the Taylor factory, which mainly carries out advanced logic foundry orders such as Tesla AI chips, the second factory will be oriented to serve the AI computing power industry chain and specialize in producing the base die required for high-bandwidth memory (HBM). (Sina Finance)

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